Ring diamond thin wire cutting machine.

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Used for cutting of photovoltaic and semiconductor silicon wafers, crystal cutting, jade, special glass, powder metallurgy materials, magnetic materials, stone, tire detection and cutting. With ⌀0.5~3.0mm ring diamond thin wire.

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Company address：NO.20 Tieshan Road Guilin, Guangxi, China

Domestic sales Tel：0773-5868821

Export Tel：0773-5868880

Email：jane@china-diamondtool.com

Reporting telephone：5839856

Reporting Email：895333640@qq.com

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